product specification series: FSI 1,00 mm one piece interface revision: d date: october 30, 2015 ? samtec, inc. page 1 FSI series C 3 mm body height, double row other configurations available for: taller body heights . s ingle row. threaded inserts, alignment pins, pick & place pads and packaging options . see www.samtec.com for more information.
product specification series: FSI 1,00 mm one piece interface revision: d date: october 30, 2015 ? samtec, inc. page 2 1.0 scope 1.1 this specifi cation covers performance, test ing and quality requirements for s amtec FSI series 1,00 mm pitch one piece interface . this one piece interface is available in single and double row configurations for 3 mm, 6 mm, an d 10 mm board stacking applications . all information contained in this specification is for a 3 mm body height , double row configuration unless otherwise noted. 2.0 detailed information 2.1 product prints, footprints, catalog pages, test reports and other spec ific, detailed information can b e found at www.samtec.com?FSI . 3.0 testing 3.1 current rating: 2.0 a 3.2 voltage rating: 220 vac 3.3 operating temperature range: - 55c to +125c 3.4 electrical: item test condition requirement status wit hstanding voltage eia - 364 - 20 (no flashover, sparkover, or breakdown) 650 vac pass insulation resistance eia - 364 - 21 (1 000 m? minimum) 6 ,000 m? pass contact resistance (llcr) eia - 364 - 23 15 m? maximum (samtec defined)/ no damage pass 3.5 mechanical: item test condition requirement status durability eia - 364 - 09c 100 cycles (w/env.) 1 0, 000 cycles (w/o env) pass random vibration eia - 364 - 28 condition v, letter b 7.56 g 'rms', 50 to 2000 hz, 2 hours per axis, 3 axis total , psd 0.04 visual inspection: no dama ge llc r: 15 m? maximum event detection: no interruption > 50 nanoseconds pass mechanical shock eia - 364 - 27 100 g, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) visual inspection: no damage llcr: 15 m? maximum event de tection: no interruption > 50 nanoseconds pass normal force eia - 364 - 04 30 grams minimum for gold interface pass
product specification series: FSI 1,00 mm one piece interface revision: d date: october 30, 2015 ? samtec, inc. page 3 3.6 environmental: item test condition requirement status thermal shock eia - 364 - 32 thermal cycles: 100 (30 minute dwell) hot temp: +85c cold temp: - 55c hot/cold transition: immediate visual inspection: no damage llcr: 15 m? dwv: 650 vac ir: >6 ,000 m? pass thermal aging (temp life) eia - 364 - 17 test condition 4 @ 105c condition b for 250 hours visual inspection: no damage llcr: 15 m? dwv: 650 vac ir: > 6 ,000 m? pass cyclic humidity eia - 364 - 31 test temp: +25c to +65c relative humidity: 90 to 95% test duration: 240 hours visual inspection: no damage llcr: 15 m? dwv: 650 vac ir: > 6 ,000 m? pass gas tight eia - 364 - 36 gas exposure: nitric acid vapor duration: 60 min. drying temp.: 50c +/ - 3c measurements: within 1 hour of exposure llcr: 15 m? pass
product specification series: FSI 1,00 mm one piece interface revision: d date: october 30, 2015 ? samtec, inc. page 4 4.0 normal force vs. body height FSI height max b2b for 30 grams normal force (inches) deflection range (inches) mm inch 3 0.118 0.129 0.011 6 0.236 0.247 0.011 10 0.394 0.405 0.011 5.0 h igh speed performance 5.1 based on a 3 db insertion loss 5.2 system i mpedance: 50 ohm for single - ended and 100 ohm for differential pair stack height single - ended signaling differential pair signaling 3 mm 8 ghz / 16 gbps 12 g hz / 24 gbps 6 mm 7.50 ghz / 15 gbps 7 .50 ghz / 15 gbps 10 mm 5 ghz / 10 gbps 6 ghz / 12 gbps 6.0 processing recommendations 6.1 mating r equirements : the mating card should be mated vertically to the connector . 6.1.1
product specification series: FSI 1,00 mm one piece interface revision: d date: october 30, 2015 ? samtec, inc. page 5 6.2 due to variances in equipment, solder pastes and applications (bo ard design, component density, etc.) , samtec does not specify a recommended reflow profile for our connectors . the processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. all of samtec s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in ipc/jedec j - std - 020 e which requires that components be capable of withstanding a peak temperature of 260c as well as 30 seconds above 255c. samtec recommended temperature profile ranges (smt) sn - pb eutectic assembly preheat/soak (100c - 150c) max ramp up rate reflow time (above 183c) peak temp time within 5c of 235c max ramp down rate time 25c to peak temp 60 - 120 sec. 3c/s max. 40 - 150 sec. 235c 20 sec. max. 6c/s max. 6 min. max. pb - free assembly preheat/soak (150c - 200c) max ramp up rate reflow time (above 217c) peak temp time within 5c of 260c max ramp down rate time 25c to peak temp 60 - 120 sec. 3c/s max. 40 - 150 sec. 260c 30 sec. max. 6c/s max. 8 min. max. 6.2.1 these guidelines should not be considered design requirements for all applications. samtec recommends testing interconnects on your boards in your process to guarantee optimum results. 6.3 maximum reflow passes: the parts can withstand three reflow passes at a maximum component temperature of 260c.
product specification series: FSI 1,00 mm one piece interface revision: d date: october 30, 2015 ? samtec, inc. page 6 6.4 stencil t hickness: the recommended stencil thickness is .006 ( 0 , 15 mm). 6.5 placement: machine placement of the parts is recommended. 6.6 reflow e nvironment: samtec recommen ds the use of a low level oxygen environment (typically achieved through n itrogen gas infusion) in the reflow process to improve solderability. 6.7 plating: plating for the mating card to be .000030 inches gold with hardness of 120 - 200 knoop per astm b 488 t ype 2, grade c. 6.8 hardware: board - to - board standoffs are recommended to provide a robust mechanical connection. samtec s wide variety of standoff options can be found here: so - board stacking standoff . 6.9 stiffeners: it is recommended that a stiffener be used to maintain flatness of the mating card. 6.10 note: applications requiring 40 C 50 positions without threaded inserts, please contact samtec interconnect processing group at ipg@samtec.com . 6.11 cleaning: samtec has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the eia - 364 - 11a standard. 7.0 additional resources 7.1 for additional mechanical testing or product information , contact our customer engineering support group at ces@samtec.com 7.2 for additional information on high speed performance testing, contact our signal integrity group at sig@samtec.com 7.3 for additional processing information, contact our interconnect processing group at ipg@samtec.com . 7.4 for rohs, reach or other environmental compliance information , contact our product environ mental compliance group at pec@samtec.com use of product specification sheet this product specification sheet (pss) is a brief summary of information related to the product identified. as a summary, it should on ly be used for the limited purpose of considering the purchase/use of product. for specific, detailed information, including but not limited to testing and product footprint, refer to section 2.0 of this document and the links there provided to test repor ts and prints. this pss is the property of samtec, inc. (samtec) and contains proprietary information of samtec, our various licensors, or both . samtec does not grant express or implied rights or license under any patent, copyright, trademark or other p roprietary rights and the use of the pss for building, reverse engineering or replication is strictly prohibited. by using the pss, the user agrees to not infring e, directly or indirectly, upon any intellectual property rights of samtec and acknowledges th at samtec, our various licensors, or both own all intellectual property therein. the pss is presented as is. while samtec makes every effort to present excellent information , the pss is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the pss contains all necessary and/or relevant information about the product. the user agrees that all access and use of the pss is at its own risk. no warranties expressed or implied, including any warranty of merchantability, fitness for a particular purpose or of any kind whatsoever are provided.
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